Apparatus for Two-Dimensional Transducers used in Three-Dimensional Ultrasonic Imaging

ABSTRACT

A single chip transducer apparatus that includes on-chip electronic circuitry which, when connected properly to a two-dimensional matrix of ultrasonic transducer elements, provides enough information to an external imaging system to form three-dimensional images of the subject of interest. In a preferred embodiment, the circuitry provides an amplifier for each transducer element, and then conditions the output of the amplifier in several ways. In one embodiment of the invention, the elements&#39; analog voltages are stored in a sample and hold circuit, and time multiplexed into a high speed line driver that sends many elements data down the interconnect to the system&#39;s high speed Analog to Digital converters. In another embodiment, the gain of the amplifiers can be controlled in time to provide aperture translation and time based expansion for translating and focusing image slices in the elevation direction.

This application claims priority to U.S. Provisional Application Ser.No. 60/572,560 filed May 8, 2004

BACKGROUND OF THE INVENTION

1. Field of the Invention

Generally, the present invention relates to ultrasound imaging. Morespecifically, the present invention relates to microfabricatedtransducers with associated electronics capable of three-dimensionalultrasound imaging.

2. Description of the Related Art

An acoustic transducer is an electronic device used to emit and receivesound waves. Ultrasonic transducers are acoustic transducers thatoperate at frequencies above 20 KHz, and more typically, in the 1-20 MHzrange. Ultrasonic transducers are used in medical imaging,non-destructive evaluation and other applications. The most common formsof ultrasonic transducers are piezoelectric transducers. In U.S. Pat.No. 6,271,620 entitled, “Acoustic Transducer and Method of Making theSame,” issued Aug. 7, 2001, Ladabaum describes microfabricatedultrasonic transducers (MUTs) capable of competitive performancecompared to piezoelectric transducers.

In U.S. Pat. No. 6,246,158, Ladabaum teaches monolithic integration ofMUTs with circuitry. The basic transduction element of the MUT is avibrating capacitor. A substrate contains a lower electrode, a thindiaphragm is suspended over the substrate and a metallization layerserves as an upper electrode. If a DC bias is applied across the lowerand upper electrodes, an acoustic wave impinging on the diaphragm willset it in motion, and the variation of electrode separation caused bysuch motion results in an electrical signal. Conversely, if an AC signalis applied across the biased electrodes, the AC forcing function willset the diaphragm in motion, and this motion emits an acoustic wave inthe medium of interest.

In U.S. Pat. No. 6,430,109. Khuri-Yakub et al. teach the use ofthrough-wafer vias to provide electrical connections to MUT elements andthus allow connection to an image processing chip. The image processingchip is not described, and the through-wafer interconnects are taught toprovide a means for control voltages and electrical excitation of MUTs.The focus of this referenced prior art is transmission; receptiondetails are not taught. Integration of piezoelectric materials withelectronics is also known in the art, as is taught in Plummer, J.,Meindl, J., and Maginness, M., “An Ultrasonic Imaging System forRealtime Cardiac Imaging,” Proceedings of the IEEE InternationalSolid-State Circuits Conference, 1974, p. 162-163. PVDF (polyvinyldi-fluoride), a piezoelectric polymer, can be formed on an electronicsubstrate. See, for example, Reston, R. and Kolesar, E,“Pressure-sensitive field-effect transistor sensor array fabricated froma piezoelectric polyvinylidene fluoride film, Proceedings of the IEEEEngineering in Medicine and Biology Society, 1989, p. 918-919. Theauthors are not aware of high quality medical imaging piezoelectricmaterials successfully integrated directly on top of electroniccircuits, such as PZT-5H, for example, though it may be that in thefuture high quality composite piezoelectrics are successfully formed ontop of electronics. The present invention is taught with respect to amonolithically integrated MUT transducer embodiment, but need not belimited to it. Piezoelectric, through-wafer via MUTs, or other currentlyunknown transducer layers may be used on the electronic circuitry hereindisclosed.

In U.S. Pat. No. 6,106,472, Chiang and Broadstone teach a system andmethod of beam formation within a probe housing. The beam formation isaccomplished by the sampling, delay, and summation of ultrasonic channeldata. The compact nature of the beamformer is made possible by a CCDdelay chip.

None of these references teaches or claims specific structures ormethods directed to 3-D imaging.

Savord et al., in U.S. Pat. No. 6,381,197, describe the use of both biaslines and FET switches to control the aperture of a MUT array, but donot teach specific structures or methods directed to 3-D imaging.

Ultrasound systems that generate three-dimensional (3-D) images of thesubject of interest are available today. Most of the commerciallyavailable systems form three-dimensional images form multipletwo-dimensional (2-D) slices taken by a mechanically translating orrotating probe. An example of such a system is General Electric'sVoluson 730, which has its origins from the work of Kretz in Austria.U.S. Pat. No. 4,341,120, issued in 1982, describes a multi-element probethat is electronically scanned in the azimuth direction, but ismechanically moved to capture image slices in the elevation direction.

Mechanical translation suffers from several disadvantages, among themcost, reliability, and mechanical jitter. The resolution of thereconstructed image in the elevation direction is a function of theslice thickness of the elevation profile of the transducer, as well asof the positioning accuracy of the mechanical translation scheme ordevice.

Other approaches to 3-D imaging are also known in the art. Systems basedon two dimensional transducer arrays are taught, for example, in U.S.Pat. Nos. 4,694,434, 5,229,933 and 6,126,602. One disadvantage of theseconventional 3-D imaging systems based on 2-D transducer arrays is thatthe interconnecting circuitry between each individual transducer elementand its associated control circuitry can be difficult and expensive todesign and manufacture. Furthermore, parasitic resistance, capacitance,and cross-talk in the interconnect paths can degrade the performance ofthe imaging system.

In both mechanically scanned and electronically scanned approaches for3-D imaging known in the art, a disadvantage is the slow frame-rate of3-D images that is a function of a 3-D image being formed from many 2-Dslices.

In imaging applications, an ultrasonic transmitter sends ultrasoundwaves into the subject of interest, and an ultrasonic receiver detectsthe return waveforms. Typically in medical imaging, the transmitter andreceiver are the same transducer array, and timing between the elementsof the array is varied during transmit and receive events to formimages. However, the transmitter need not necessarily be the same as thereceiver. It has been realized by the present inventors that as long assufficient signal-to-noise ratio is available, a fully populated matrixof transducers can capture enough information during receive events toform 3-D images of the subject of interest. The present inventionrelates to the electronic circuitry used to control a two-dimensionalmatrix of transducers during receive events. The transducer matrix andelectronics can be MUT transducers monolithically integrated withunderlying electronics, as taught by Ladabaum, MUT transducers connectedby through-wafer vias to the electronics, as taught by Khuri-Yakub, PVDFtransducers formed over the electronics and connected to them, or otherpiezoelectric transducers not yet reduced to practice. It is criticalthat the interconnect paths between transducer element and electronicshave insignificant parasitic resistance and capacitance. Thus, themonolithic approach is the preferred embodiment.

Thus, what is needed is electronic circuitry that can be used with afully populated two-dimensional transducer array (matrix), preferably,for example, integrated immediately below the transducer matrix, andthat can provide sufficient information for the formation ofthree-dimensional images by a 3-D ultrasound imaging system. The presentinvention provides such circuitry.

SUMMARY OF THE INVENTION

The present invention provides an electronic circuit chip that, whenproperly connected to a large aperture, fully-populated 2-D transducermatrix, provides sufficient information to an imaging system to form 3-Dimages of the region of interest. The electronic circuit achieves thisby providing an amplifier for each element of the transducer matrix. Inone embodiment of the present invention the amplifier's output isconnected to signal conditioning electronics and ultimately to an analogsample-and-hold circuit. The voltages stored in the analog circuitcorresponding to several elements are then rapidly read out by amultiplexer, and transmitted to the imaging system's high speed A/Dconverter by a line driver and a suitable interconnect. In anotherembodiment of the present invention, the analog sample-and-hold circuitis triggered at different times for different elements in a set, and thestored voltage samples in the set are summed together beforetransmission to the system's A/D converter. In yet another embodiment ofthe present invention, the output of the amplifiers is summed withoutthe track and hold circuit, with the gain of each amplifier in theelement set varied in time to control elevation aperture and focusing.In yet another embodiment, frequency domain multiplexing is used asopposed to time-base multiplexing so that a single interconnect line cancarry many channels worth of data.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other aspects and features of the present invention willbecome apparent to those of ordinary skill in the art upon review of thefollowing description of specific embodiments of the invention inconjunction with the accompanying figures, wherein:

FIG. 1 illustrates the a fully populated receive aperture used toimplement a three-dimensional (3-D) imaging system according to anembodiment of the present invention;

FIG. 2 illustrates exemplary signal conditioning circuitry that can beintegrated below the cMUT array according to an embodiment of thepresent invention;

FIG. 3 illustrates a column multiplexed readout method according to anembodiment of the present invention;

FIG. 4 illustrates a method that multiplexes the outputs of manyelements (e.g., M elevation elements) together in time according to anembodiment of the present invention;

FIG. 5 illustrates a line amplifier that can be at the end of the linesof the multiplexed transducer elements according to an embodiment of thepresent invention;

FIG. 6 illustrates the circuit architecture for partial beam formationaccording to an embodiment of the present invention;

FIG. 7 illustrates an embodiment of the signal conditioning circuitryblocks that can be integrated below the transducer array according to anembodiment of the present invention;

FIG. 8 illustrates one embodiment of a simple adder with time-varyinggain used to sum the outputs of amplifiers corresponding to severaltransducer elements according to an embodiment of the present invention,and

FIG. 9 illustrates the elevation aperture translation and focusingachieved by varying the amplifier gain in the elevation directionaccording to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will now be described in detail with reference tothe drawings, which are provided as illustrative examples of theinvention so as to enable those skilled in the art to practice theinvention. Notably, the figures and examples below are not meant tolimit the scope of the present invention. Where certain elements of thepresent invention can be partially or fully implemented using knowncomponents, only those portions of such known components that arenecessary for an understanding of the present invention will bedescribed, and detailed descriptions of other portions of such knowncomponents will be omitted so as not to obscure the invention. Further,the present invention encompasses present and future known equivalentsto the components referred to herein by way of illustration.

FIG. 1 illustrates a fully populated receive aperture 100 used toimplement a three-dimensional (3-D) imaging system according to anembodiment of the present invention. Such an aperture can produce highquality 3-D images. As shown in FIG. 1 for illustrative purposes, the2-D capacitive microfabricated ultrasonic transducer (cMUT) arrayconsists of a two-dimensional (2-D) grid of cMUT elements 110. Thevertical columns of cMUT elements are in the elevation direction, withthe azimuth direction shown along the horizontal direction (i.e., inrows). Below the cMUT cells (not shown), according to an aspect of thisembodiment, there can be integrated electronics and signal conditioningcircuitry 120, which can be integrated circuits disposed into thesubstrate of the cMUT. While it is preferred that the circuitry for eachcell be disposed below that cell, other arrangements are within thescope of this invention, such that the integrated electronics and signalconditioning circuitry 120 is below the transducer array.

The present invention and its several embodiments focus on electroniccircuitry capable of transmitting sufficient information from eachtransducer element in a 2-D matrix to a 3-D imaging system. For example,if there are N elements in the azimuth direction of the array, and Melements in its elevation direction, then NM intermediate outputs needto be read out into the ultrasound system. Image quality requirements ofmodern scanners dictate that the product NM>4000. Of course the presentinvention will be equally as applicable to future advances in the art ofscanners. It is impractical to connect a cable to each of the elementsand provide a probe which can be manually manipulated by thesonographer. Various multiplexing methods for achieving thecommunication between the transducer and the ultrasound system accordingto the present invention are described below.

As will become evident to those skilled in the art in view the teachingof at least some aspects of the present invention, the exemplaryembodiments are not intended to be limited to use with capacitivemicrofabricated ultrasonic transducers. Rather, aspects of the presentinvention are equally applicable to many other types of transducers,including, but not limited to, piezoelectric polymers (e.g., polyvinyldifluoride, or PVDF), piezoelectric film (e.g., sol gel spin-ondepositions) and other piezoelectric materials (e.g., PZT-5H). Further,the electronics taught by the present invention, while illustrated asbeing monolithically integrated with the transducer matrix, can be aseparate integrated circuit or discrete elements or a combination of allof the above (i.e., on-chip, off-chip, integrated, discrete, etc.).

FIG. 2 illustrates exemplary signal conditioning circuitry 200 that canbe integrated below the cMUT array according to an embodiment of thepresent invention. As shown in FIG. 2, the acoustic element 210 can befirst connected to a low noise amplifier 220 with high input impedance.This tends to raise the signal level above the thermal noise floor, andcan buffer the impedance from that of the element 210 to make thesubsequent circuitry more straightforward. The input impedance of thisamplifier 220 can affect the acoustic reflectivity of the receiversurface, and should therefore be chosen judiciously. For example, thisinput impedance can be approximately the complex conjugate of theelectrical impedance of the transducer element 210 (as first taught inU.S. patent application Ser. No. 10/803,808 to Hossack et al., filed onMar. 17, 2004 and entitled “Electric Circuit for Tuning a CapacitiveElectrostatic Transducer”).

The output of the low noise amplifier 220 can be connected to avariable-gain stage 230. This stage can decrease the dynamic rangerequirements of the electronics that follow it by increasing its gainwith time, for example, as the acoustic pulse is attenuated through thebody. Following the time gain control stage 230 is an anti-aliasingfilter 240, which can substantially eliminate (i.e., attenuate to belowan electrically-significant level) the frequency content in the signalabove the Nyquist frequency. The Nyquist frequency can be set by theclock rate of the next stage, a sample and hold circuit 250, and isgenerally equal to about twice the frequency of the upper frequency edgeof the desired passband. The sample and hold circuit can include atrack-and-hold trigger 255 that, in this embodiment can be driven by afixed frequency. In one embodiment, after the signal conditioningcircuitry, an amplified and sampled signal is available at theintermediate output 260 under each 2-D array element for the duration ofeach clock period.

In the simplest embodiment, the receive chip is simply read out onecolumn at a time. A three dimensional image can be formed at the expenseof N times the number of transmit-receive events required for a twodimensional image. A typical modern ultrasound machine can form 30 2-Dimages per second, so in the case of an N by M transducer matrix, avolumetric image could be obtained in N/30 seconds. As an example thetransducer matrix might be a 64 by 128 matrix, so that a volumetricimage frame would require 2.1 seconds.

FIG. 3 illustrates a column multiplexed readout chip 300 according to anembodiment of the present invention. A multiplexer can connect onecolumn out of N 310 to the M interconnects 320 which are wired to theultrasound system. The disadvantage of this approach is the slow natureof the image acquisition, and thus the requirement that the subject ofinterest remain still over the acquisition time period, or that motioncompensation algorithms be employed by the system. As will be evident tothose skilled in the art with reference to this disclosure, the azimuthrows could just as easily be multiplexed in M times the number oftransmit-receive events, and N azimuth interconnects connected to theultrasonic system.

Another embodiment of the present invention is illustrated in FIG. 4,which shows a chip 400 that captures samples of each transducer elementat the Nyquist rate, for example, 20 Mega-samples per second, but duringthe holding period, quickly and serially multiplexes the sampled outputsof many elements (e.g., M elevation elements) to a single systeminterconnect line. This type of time multiplexing is much faster becauseeven though the ultrasonic sampling rate is 20 Mega-samples per second,by way of example, the serialized data rate can be at least ten timesfaster. For example, the voltage from each element of a line of elements410 is connected sequentially to the input of a high-speed amplifier andcoaxes 420, and the combined data sent to the ultrasound system. Thisprocess can occur at about 200 Mega-samples per second, and even faster,depending on the electrical characteristics of the interconnect path andthe line driver. Line drivers with GHz bandwidths are known in the art.In this way, the number of interconnects can be reduced to a manageablenumber. As will be evident to those skilled in the art with reference tothis disclosure, the azimuth rows could just as easily be multiplexed intime, and M elevation interconnects connected to the ultrasonic system.According to this aspect, all of the information from every element inthe array can be preserved.

FIG. 5 illustrates more detail of the multiplexed line of elements 500of the embodiment of FIG. 4. As shown in FIG. 5, a high speed lineamplifier 510 can be at the end of the lines of the multiplexedtransducer elements 520 according to an embodiment of the presentinvention. The line amplifier 510 can also be connected to theultrasound system (not shown) via a high-speed output 530. Theelectrical circuit 540 for this embodiment can include the line driver550 that serves as an impedance buffer between the system interconnect560 and the multiplexing 570 of the transducer elements' intermediateoutputs 580, and provides sufficient power to drive the interconnectline 560 with high analog fidelity to the A/D converter 590 in theultrasound system.

Upon review of the preceding description of time multiplexing, it willbe clear to those skilled in the art that the same effect can beobtained by frequency domain multiplexing. Instead of dividing up theavailable clock period into smaller slices of time, the bandwidth isdivided up and the channel data modulated up to unique frequencysegments of the bandwidth available in the line amplifier andinterconnect. On the system end, filters, either digital or analog, canbe used to extract the waveforms corresponding to each element. This andother variations in multiplexing methods are intended to be within thescope of the present invention.

Another aspect of the present invention includes control of thetransducer array such that delays can be introduced between elements inthe elevation direction, for example, and that subsequently samples aresummed to provide a partially beam-formed output. In some applications,it may be advantageous to have such a pre-beam-formed output, whichemerges at a lower data rate than that produced by a time-multiplexed orfrequency-multiplexed output. The bandwidth required at the interconnectpath and A/D converter would only need to be enough to pass the sampledoutput of a single channel. This bandwidth is typically in the range ofabout 20 MHz up to about 70 MHz.

FIG. 6 illustrates the circuit architecture for a partially beam-formedtransducer 600 according to an embodiment of the present invention. Inthis embodiment, each element's track-and-hold trigger (not shown) isnot driven with a fixed frequency. Instead, the elevation control lines620 create a dynamically varying delay between adjacent elevationelements 640, which determines the elevation beam steering angle and thefocal length, and can be provided in the system 630. They create adynamic focus on receive by supplying a delay 644 that compensates forthe difference in travel time between adjacent elements 640 and adding646 in that delay. Thus, a delay from an adjacent element 650 is passedto the adder 646 of that adjacent element, and so on 660. The quantityof delay changes as the sound pulse travels deeper into the body, forexample; the schedule of such delay changes depends on the element'slocation. This achieves a “tracking lens” ensuring that the receivedsignal is in focus at all times. For high-quality beam formation,dynamic control of amplitude is also necessary. This may be accomplishedby supplying appropriate control signals to the previously describedtime-gain-control block. If the focal range is r, and the elevationsteering angle is φ, two elements positioned at (y, 0) and (y+Δy, 0)require a delay of:

${\Delta \; t} = {\frac{1}{c}\left\lbrack {\sqrt{\left( {{r\; \sin \; \varphi} - y} \right)^{2} + {r^{2}\cos^{2}\varphi}} - \sqrt{\left( {{r\; \sin \; \varphi} - \left\lbrack {y + {\Delta \; y}} \right\rbrack} \right)^{2} + {r^{2}\cos^{2}\varphi}}} \right\rbrack}$

in which r=r(t) for dynamic focusing. This delay is accomplished in twoways; for a coarse delay (i.e. a delay greater than the samplingperiod), an analog FIFO is provided between the elements. The fine delayis realized by slipping the sampling clock. Note that this delay can besubstantially identical for all members of an elevation row, so that thedelay control can be substantially identical across an elevation row, asillustrated conceptually in the close-up view in FIG. 6. Although each“elevation delay control” is depicted as one line, in actual physicalimplementation, each “elevation delay control” line in the schematic cancorrespond to several conductive traces that control the sample triggeras well as the reconfigurable FIFO. One of the key attributes is thatthe control traces can extend across the array because each azimuthelement has substantially identical elevation control.

The consequence of this on-chip processing is that pre-beam-formed datais available at the output of each piece of the overall azimuth element630. In the simplest case, the entire azimuth column 630 undergoes beamformation. If there are N azimuth columns in the array, these N linestravel over traditional cables to the imaging system. In the system,dynamic delays are provided to create focusing in the azimuth direction:for elements at (x, 0) and (x+Δx, 0) and an azimuth steering angle of θ,

${\Delta \; t} = {\frac{1}{c}\left\lbrack {\sqrt{\left( {{r\; \sin \; \theta} - x} \right)^{2} + {r^{2}\cos^{2}\theta}} - \sqrt{\left( {{r\; \sin \; \theta} - \left\lbrack {x + {\Delta \; x}} \right\rbrack} \right)^{2} + {r^{2}\cos^{2}\theta}}} \right\rbrack}$

FIG. 7 illustrates an embodiment of the signal conditioning circuitry700 that can be integrated below the transducer array according to anembodiment of the present invention. This embodiment can achieve a finedelay by slipping the sample and hold's trigger 720. FIG. 7 only showsone stage of course delay 710, but such a delay can contain severalstages, for example, a FIFO whose delay is switchable down the beam.Such a FIFO might hold several samples inside it to wait long enough tocorrectly add an element's voltage to that of the adjacent elements. Aswill now be evident to those skilled in the art, several methods ofimplementation for this coarser delay are possible, for example, such asusing structures that look like DRAM cells, cascaded track & holds, CCDsor switched-capacitor circuits, all of which are intended to beencompassed within the scope of the present invention. The delayedsignals of elevation elements can be summed together 730 and transmitteddown an interconnect path 740 to the imaging system.

The advantage of this circuit, which provides partially beam-formeddata, is that outputs to the system are lower speed and require lessbandwidth, but it does not supply the raw sampled data from everyelement in the beam-formed direction, so there is some information loss.Such information loss can be acceptable under certain conditions.

A further, simplified embodiment of the present invention, one withoutthe need for sample and hold circuitry, is illustrated in FIGS. 8 and 9.In this embodiment, 3-D image formation is made in an analogous mannerto mechanical translation of a 1-D probe. Rather than mechanicaltranslation, the aperture of the transducer is electronicallytranslated, for example, in the elevation direction. Only amplifierblocks are needed. Because no sample and hold block is present, ananti-aliasing filter is also unnecessary. Electronic aperture can betranslated by controlling the gain of each amplifier in time. FIG. 8illustrates one embodiment of a simple adder 800 with time-varying gain810 used to sum the outputs of amplifiers corresponding to severaltransducer elements 820 to a single output 830 according to anembodiment of the present invention.

In this embodiment, aperture translation is necessary, but notsufficient. For a given aperture position, some degree of elevationfocusing would be desirable. Because the aperture is translated, a fixedmechanical lens on the transducer is not possible. However, effectivefocusing can be achieved by judicious time-based expansion of theaperture. FIG. 9 illustrates the concept by showing 4 time snapshots ofthe elevation profile 900 of the gain of the amplifier blocks. This gainprofile can be achieved in a simple manner by control lines 910 thattraverse the electronic circuit chip and connect to the amplifierblocks. Traditional ultrasound cable outputs 920 can be used for thisembodiment.

The first two time snapshots are at a first beam position 930. The firsttime snapshot is the curve of a first short range apodize gain pattern934. This elevation gain pattern provides for focusing in the shortrange. The second time snapshot is the curve of a first long rangeapodize gain pattern 936. By varying the gain smoothly in time from thefirst short range snapshot to the first long-range snapshot in a mannercorrelated with the speed of sound in the subject of interest, a narrowslice thickness for the first beam position 930 can be achieved. Thenext two time snapshots are at a second beam position 940. This secondbeam position 940 can likewise include a second short range gain pattern944 and a second long-range gain pattern 946. In order to form a 3-Dimage, many such beam positions, each providing for smooth gainvariation to generate thin image slice thickness, are required. Theadvantage of this fully, electronically translated and focused apertureis that trade-offs between frame rate and image slice thickness (whichtranslates to resolution in the elevation direction) can be made, andall the control is achieved by M signal lines in an N by M transducermatrix.

Although the present invention has been particularly described withreference to embodiments thereof, it should be readily apparent to thoseof ordinary skill in the art that various changes, modifications andsubstitutes are intended within the form and details thereof, withoutdeparting from the spirit and scope of the invention. Accordingly, itwill be appreciated that in numerous instances some features of theinvention will be employed without a corresponding use of otherfeatures. Further, those skilled in the art will understand thatvariations can be made in the number and arrangement of componentsillustrated in the above figures. It is intended that the scope of theappended claims include such changes and modifications.

1-37. (canceled)
 38. An apparatus for providing analog ultrasonicimaging data signals, the apparatus comprising: a chip; a transducerarray having a plurality of transducer elements that forms part of thechip, each receive element adapted to produce received analog ultrasonicsignals on a signal line; a plurality of conditioning circuits adaptedto provide signal conditioning to the received analog ultrasonic signalsand produce conditioned analog ultrasonic imaging data signals, eachconditioning circuit forming another part of the chip, being disposedsubstantially below one of the transducer cells associated therewith,and coupled to one of the signal lines; and an output circuit thatfrequency multiplexes the conditioned analog ultrasonic imaging datasignals to form the analog ultrasonic imaging data signals, the outputcircuit being coupled to the plurality of conditioning circuits andforming another part of the chip.
 39. The apparatus of claim 38 whereinthe output circuitry modulates different sets of the conditioned analogultrasonic imaging data signals on respectively different carrierfrequencies.
 40. The apparatus of claim 39 wherein each of the differentcarrier frequencies with sets of the conditioned analog ultrasonicimaging data signals modulated thereon are output as the analogultrasonic imaging data signals on a common output line. 41-45.(canceled)